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Ceramic Chip
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Multilayer Ceramic Chip Capacitors with thin layers of ceramic dielectric give electrical characteristic similar to ceramic disc capacitors; although they are smaller size they can have greater capacitance. These Chips are designed and manufactured to meet standard EIA requirements making them well suited for use in commercial, industrial, and telecommunications equipment.

Epoxy-Dipped Multilayer Ceramic Capacitors feature multilayer ceramic chip capacitors with solder connected leads encapsulated with a coating insulation. These can be supplied in bulk or tape package.

  • Multilayer ceramic chip capacitors from 0402 through 3640
  • High voltage (200V-1KV) in COG in sizes from 0805 to 1812
  • Radial leaded, epoxy dipped multilayer ceramic capacitors
  • Axial leaded, epoxy coated multilayer ceramic capacitors
  • Capacitor Networks (SIP)
  • Temperature Compensating multilayer ceramic capacitors

Click on the series capacitor of interest for more complete details and specifications:

CAPACITOR TYPE DESCRIPTION TEMPURATURE COEFFICIENTS
MLCC NPO Multi-Layer Ceramic Chip NPO (COG)
MLCC X7R Multi-Layer Ceramic Chip X7R
MLCC Z5U & Y5V Multi-Layer Ceramic Chip Z5U & Y5V
ALL MLCC Chips Multi-Layer Ceramic Chip Packaging Information
MLCC SIP 4 to 14 Pins in 4 configurations NPO, X7R, Z5U
MLCC Epoxy Radial Radial Multi-Layer Ceramic Chip NPO, X7R, Z5U, Y5V
MLCC Epoxy Axial Axial Multi-Layer Ceramic Chip NPO, X7R, Z5U, Y5V
Download Complete Laube MLCC Catalogs


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